Advanced Semiconductor Bonding Expert
2 days ago
TCB System Integration Specialist
Job Description:Seamless integration and bonding of semiconductor components require a highly skilled TCB system specialist. This role involves the design, development, and optimization of TCB modules for advanced packaging processes.
The ideal candidate will have expertise in thermal management, mechanical engineering, and materials science. They should be able to analyze thermal simulations (CFD, FEA) and optimize heating/cooling profiles.
Key Responsibilities:- Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding, responsible for 3D design, 2D drawings, BOM management, and DFMA.
- Prototyping & Testing: Oversee fabrication of prototype modules, analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity.
- Process & Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers for machine integration and ensure safe, robust assembly of module systems.
- Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards.
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- Experience with TCB or Laser Assisted bonding technologies is highly preferred.
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