Current jobs related to Advanced Semiconductor Packaging Expert - Singapore - beBeeThermal

• 

  Semiconductor Packaging Expert

  1 week ago

  ---

  Singapore beBeePackaging Full time $80,000 - $120,000

  Job Title: Semiconductor Packaging ExpertThis role is focused on designing, developing and optimizing TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The ideal candidate will possess strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding...

• 

  Advanced Packaging Expert

  2 weeks ago

  ---

  Singapore beBeePackaging Full time $150,000 - $200,000

  Job TitleA seasoned semiconductor expert is sought to join our Advanced Packaging team in Singapore. The ideal candidate will have extensive experience in designing and optimizing advanced packaging processes.

• 

  Senior Semiconductor Packaging Design Expert

  1 week ago

  ---

  Singapore beBeeSemiconductor Full time

  Job Summary: We are seeking a skilled Senior Semiconductor Packaging Design Expert to join our team. The ideal candidate will have extensive experience in designing and developing advanced semiconductor packaging solutions. About the Role: The Senior Semiconductor Packaging Design Expert will be responsible for leading the design and development of TCB...

• 

  Semiconductor Assembly Packaging Expert

  1 week ago

  ---

  Singapore beBeePackaging Full time $80,000 - $150,000

  We are seeking an expert in semiconductor assembly to lead the development of advanced packaging technologies and processes.Key ResponsibilitiesDesign innovative packaging solutions that enhance device performance and yield.Provide technical support and collaborate with external customers and partners for joint development.Work closely with internal R&D and...

• 

  Senior Semiconductor Packaging Design Expert

  2 weeks ago

  ---

  Singapore beBeeSemiconductor Full time $6,000 - $8,000

  Job Summary:We are seeking a skilled Senior Semiconductor Packaging Design Expert to join our team. The ideal candidate will have extensive experience in designing and developing advanced semiconductor packaging solutions.About the Role:The Senior Semiconductor Packaging Design Expert will be responsible for leading the design and development of TCB modules...

• 

  Semiconductor Packaging Expert

  1 week ago

  ---

  Singapore beBeePackaging Full time $80,000 - $120,000

  Job Title: Advanced Semiconductor Assembly SpecialistJob Summary:This is a challenging role for an experienced Packaging Engineer to take on, contributing to the success of our organization.We are seeking a highly skilled and experienced Senior Packaging Engineer to join us. The successful candidate will be responsible for developing advanced packaging...

• 

  Semiconductor Packaging Expert

  2 weeks ago

  ---

  Singapore beBeeEngineering Full time $90,000 - $120,000

  About the RoleOur company is seeking a skilled Application/Process Engineer to support the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.

• 

  Advanced Semiconductor Packaging Specialist

  1 week ago

  ---

  Singapore beBeeEngineer Full time

  Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

• 

  Advanced Semiconductor Packaging Specialist

  2 weeks ago

  ---

  Singapore beBeeSemiconductor Full time $90,000 - $120,000

  TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...

• 

  Advanced Semiconductor Packaging Specialist

  1 week ago

  ---

  Singapore beBeeThermocompression Full time $80,000 - $120,000

  TCB Design Engineer Job SummaryThis role is responsible for designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. The TCB Design Engineer will play a critical part in ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.