Advanced Semiconductor Packaging Specialist

18 hours ago

Singapore beBeeEngineer Full time
Job Title: TCB Design Engineer
The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.
Key Responsibilities:
  • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  • Plan, schedule and cost machines and modules.
  • Develop and test prototypes, analyze results and troubleshoot failures related to temperature non-uniformity or material degradation.
Requirements:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering or a related field.
  • Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging.
  • Excellent trouble-shooting, risk analysis and statistical analysis skills.
Benefits:
This role offers the opportunity to work on cutting-edge technology, collaborate with experienced engineers and contribute to the advancement of the semiconductor industry.

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