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Advanced Semiconductor Packaging Specialist

2 weeks ago

Singapore beBeePackaging Full time $60,000 - $80,000

We are seeking an experienced Advanced Packaging Design Engineer to join our team. As a key member of the engineering department, you will be responsible for designing and developing innovative packaging solutions for advanced semiconductor products.

The ideal candidate will have a strong background in mechanical engineering and experience with packaging design tools such as CAD software.

Key Responsibilities:
  • Design and develop advanced packaging modules for Chip-to-Wafer or Chip-to-Substrate bonding
  • Collaborate with cross-functional teams to ensure seamless integration with TCB platforms
  • Analyze test results and identify design improvements

Requirements:

  • Bachelor's degree in Mechanical Engineering or related field
  • 5+ years of experience in packaging design
  • Strong knowledge of CAD software and simulation tools
  • Excellent communication and collaboration skills

Benefits:

  • Competitive salary and benefits package
  • Opportunity to work on cutting-edge projects
  • Collaborative and dynamic work environment