Advanced Semiconductor Packaging Specialist

1 week ago

Singapore beBeeSemiconductor Full time $120,000 - $200,000
Job Title:

TCB Design Engineer

Job Description:

We are seeking a skilled engineer to join our team in the design and development of TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The successful candidate will be responsible for designing, developing, and optimizing TCB modules.

Key Responsibilities:

  • Design & Development
    • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    • Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    • Oversee fabrication of prototype modules and their integration with TCB platforms.
    • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    • Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    • Document all designs, simulations, and test results according to quality management and IP standards.
    • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Requirements:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

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