Advanced Semiconductor Packaging Engineer

Job Title: Advanced Semiconductor Packaging SpecialistLocation: Admiralty Street, SingaporeJob Description:We are seeking an experienced Advanced Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing innovative packaging solutions for semiconductor devices.Key Responsibilities:Design...

Job Title: High-Temperature Bonding SpecialistRole Summary:We are seeking a skilled professional to design and develop Thermo-Compression Bonding modules for advanced semiconductor packaging. The ideal candidate will be responsible for creating innovative designs that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

Micron's vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to...

TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...

**Job Title:** Advanced Packaging Design Engineer – Thermo-Compression Bonding SystemsThis is a challenging role that requires expertise in designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.The successful candidate will be responsible for creating innovative...

Job Title: Thermo Compression Bonding Design EngineerOur company is seeking a skilled Thermocompression Bonding (TCB) Design Engineer to join our team. As a TCB Design Engineer, you will be responsible for designing, developing, and optimizing the TCB modules subsystem used in thermo-compression bonding equipment for advanced semiconductor packaging.

Key ResponsibilitiesWe are seeking a skilled engineer to design, develop and optimize TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Must-have:Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings,...

We are seeking an experienced Advanced Packaging Design Engineer to join our team. As a key member of the engineering department, you will be responsible for designing and developing innovative packaging solutions for advanced semiconductor products.The ideal candidate will have a strong background in mechanical engineering and experience with packaging...