Advanced Semiconductor Packaging Engineer
2 days ago
We are seeking a skilled engineer to design, develop and optimize TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
- Must-have:
- Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA). Planning, Scheduling and Costing of Machines Modules.
- Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for machine integration. Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls). Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems. Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
- Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards. Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
- Good-to-have:
- Thermal & Mechanical Analysis: Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/bondstage. Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/bondstage to achieve rapid cooling and enhance temperature uniformity. Mounting of the heater assembly for micron-level Z positioning and planarity during operation.
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