Engineer, Advanced Packaging Equipment Engineering

3 weeks ago

Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
Roles & Responsibilities

Job Description

Responsibilities

Equipment Development:

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking

• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity

Equipment Tactics:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products. cost, availability, and improve hardware and process capability

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

Requirements

  • B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
  • Experience in semiconductor process or equipment engineering experience would be beneficial
  • Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware would be beneficial
  • Tenacity to work effectively under timelines and limited resources
  • Consistent track record to solve problems and address root causes

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Tell employers what skills you have

Tactics
Materials Science
Data Analysis
Technology Development
Quality Improvement
Process Capability
Physics
Manufacturing Processes
Electrical
Product Engineering
Packaging
Product Development
Assembly
Electrical Engineering
Chemical Engineering
Mechanical Engineering

  • Engineer, Advanced Packaging Equipment Engineering

    2 weeks ago

    Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

    Job Description Responsibilities Equipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • Evaluate and promote new equipment...

  • Engineer, Advanced Packaging Equipment Engineering

    7 days ago

    Singapore 1100 Micron SemiAsiaOP Pte Ltd Full time

    Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all...

  • Advanced Packaging Equipment Engineer

    2 weeks ago

    Singapore beBeePackaging Full time

    Job Description We are seeking an experienced engineer to join our team in developing advanced packaging equipment. The successful candidate will be responsible for designing, optimizing, and implementing innovative solutions for wafer-level packaging and stacking. They will work closely with cross-functional teams to integrate manufacturing processes...

  • Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering

    7 days ago

    Singapore Micron Technology Full time

    Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...

  • Engineer, Advanced Packaging Equipment Engineering

    19 hours ago

    Singapore Micron Full time

    **Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...

  • Senior Advanced Packaging Equipment Engineer

    2 weeks ago

    Singapore beBeeInnovation Full time $80,000 - $120,000

    Advanced Packaging Equipment EngineerJoin a dynamic team passionate about harnessing cutting-edge technology to drive innovation.

  • Packaging Equipment Development Engineer

    2 weeks ago

    Singapore beBeePackaging Full time $100,000 - $150,000

    Packaging Equipment Development EngineerJob Summary: We are seeking a skilled Packaging Equipment Development Engineer to develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.B.S/M.S./Ph.D. in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics,...

  • Advanced Packaging Engineer

    7 days ago

    Singapore beBeeProcess Full time

    Job Title: Process Engineer Laser-Assisted Bonder "> Location: Admiralty, Singapore Job Summary: The Laser-Assisted Bonding Process Engineer plays a crucial role in developing and optimizing laser bonding processes for advanced packaging applications. Key responsibilities include process development and optimization, equipment management, and...

  • Advanced Packaging Engineer

    2 weeks ago

    Singapore beBeeProcess Full time $150,000 - $200,000

    Job DescriptionAs a highly skilled Process Engineer, you will play a key role in the development, optimization, and maintenance of laser bonding processes.Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.Qualify new laser bonding processes from R&D to high-volume production.Specify,...

  • Advanced Packaging Engineer

    2 weeks ago

    Singapore beBeeProcess Full time

    Job Description As a highly skilled Process Engineer, you will play a key role in the development, optimization, and maintenance of laser bonding processes. Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Qualify new laser bonding processes from R&D to high-volume production. ...