Advanced Packaging Engineer

5 days ago

Singapore beBeeProcess Full time $150,000 - $200,000
Job Description

As a highly skilled Process Engineer, you will play a key role in the development, optimization, and maintenance of laser bonding processes.

  • Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
  • Qualify new laser bonding processes from R&D to high-volume production.
  • Specify, program, and refine laser bonder equipment and processes.
  • Troubleshoot laser systems and bonding processes.
  • Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies.

Responsibilities:

  • Collaborate with operators and maintenance teams to analyze and resolve yield, quality, and reliability issues.
  • Work closely with R&D, operations, and quality teams to provide technical training and support.
  • Ensure adherence to laser safety regulations and best practices.
  • Provide technical insights and support for customer programs and technology upgrades.

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • Experience with Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools.
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills.
  • Knowledge of bonding process and materials behavior under thermal/mechanical stress.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

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