Advanced Packaging Engineer

2 days ago

Singapore beBeeEngineering Full time $80,000 - $150,000
Advanced Packaging Equipment Engineering

We are seeking a highly skilled and motivated equipment engineer to join our team in Singapore. This is an exciting opportunity to develop and optimize unit processes for advanced packaging.

The primary responsibilities of this position include developing and optimizing processes for bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level). Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Key Responsibilities:

  • Manage new equipment start-up, qualification and tool matching to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
  • Designing, executing, and analyzing experiments to develop advanced packaging process (bond/debond, die re-constitution, annealing/RTA) to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. Tool stability, cost of ownership) targets.
  • Liaise & work with vendors to resolve equipment issues and improve equipment performance
  • Improve Equipment robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
  • Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity
  • Sustain and improve on SPC, DOE, FDC, ECMS and all the statistical analysis tools to optimizing equipment robustness
  • Implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
  • Provide long term solution to address daily issues. Resolve department hardware chronicle issues
  • To work closely with Process team to improve equipment productivity indices
  • Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock
  • Forecast financial budgets for equipment expenditures.

Required Skills and Qualifications:

  • BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline
  • Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.
  • Excellent verbal and written communication skills.
  • Strong interpersonal skills and ability to work effectively with different cultures.

Benefits:

GlobalFoundries offers a diverse and inclusive workplace where employees feel respected, valued, and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

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