Advanced Packaging Solutions Engineer

2 days ago


Singapore beBeeIntegration Full time $80,000 - $120,000
Job Title

Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power CMOS platforms.

">Key Responsibilities:
  • Develop and integrate advanced packaging processes for ULP CMOS platforms.
  • Lead the development of D2W and W2W bonding solutions.
Required Skills and Qualifications:
  • Strong understanding of semiconductor manufacturing processes.
  • Experience in advanced packaging technologies.
  • Excellent communication and leadership skills.
Benefits:

Competitive salary and benefits package, opportunities for professional growth and development.

Why This Role is Important:

This role plays a critical part in the development of cutting-edge packaging technologies for ULP CMOS platforms.



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