
Advanced Packaging Solutions Specialist
2 days ago
We are seeking a highly skilled Thermal Solutions Developer to drive the development of advanced packaging solutions for next-generation hybrid bonding.
The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning.
Key Responsibilities:
- Develop thermal solutions for advanced packaging applications
- Lead 3DHI process development efforts
- Work with cross-functional teams to integrate new processes and technologies
- Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes
- Facilitate interactions between fab teams and customers
Requirements:
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field
- MS degree with at least 10 years of prior related work experience
- Language Fluency - English (Written & Verbal)
Preferred Qualifications:
- PhD education level preferred with at least 8 years of prior related work experience
- Demonstrated prior leadership experience
- Project management skills
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