Advanced Packaging Solutions Specialist

2 days ago


Singapore beBeePackaging Full time $90,000 - $120,000

We are seeking a highly skilled Thermal Solutions Developer to drive the development of advanced packaging solutions for next-generation hybrid bonding.

The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning.

Key Responsibilities:

  • Develop thermal solutions for advanced packaging applications
  • Lead 3DHI process development efforts
  • Work with cross-functional teams to integrate new processes and technologies
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes
  • Facilitate interactions between fab teams and customers

Requirements:

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field
  • MS degree with at least 10 years of prior related work experience
  • Language Fluency - English (Written & Verbal)

Preferred Qualifications:

  • PhD education level preferred with at least 8 years of prior related work experience
  • Demonstrated prior leadership experience
  • Project management skills


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