Advanced Packaging Solutions Leader

1 day ago


Singapore beBeePackaging Full time $120,000 - $200,000
Advanced Packaging Solutions Lead

Job Overview

The Advanced Packaging Solutions Lead is responsible for spearheading the development of cutting-edge packaging solutions that align with our strategic vision.


Key Responsibilities
  • Oversee a team of researchers and engineers in the development of advanced packaging solutions.
  • Manage multiple R&D projects through their entire lifecycle, from conceptualization to commercialization.
  • Collaborate closely with cross-functional teams to ensure seamless integration of new technologies into our production processes.
  • Stay abreast of industry trends and emerging technologies in advanced packaging, driving innovation and contributing to our long-term technological leadership.
Requirements
  • A Master's degree or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a closely related field.
  • No less than 8 years of relevant industry experience, including at least 3 years in a managerial or leadership capacity overseeing R&D or technology projects.
  • Strong technical knowledge in areas such as System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and Heterogeneous Integration.
Essential Skills
  • Materials Science
  • Leadership
  • Hardware
  • Quality Assurance
  • Risk Management
  • Reliability
  • Research and Development
  • Project Management
  • Packaging
  • Communication Skills
  • Product Development
  • Manufacturing
  • Electrical Engineering
  • Electronics
  • Mechanical Engineering
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