Senior Leader for Advanced Packaging Solutions

2 days ago


Singapore beBeeLeadership Full time
Job Description">

Sr. Manager in Package Development & Engineering:

We are seeking a highly experienced and skilled Sr. Manager to lead our Package Development & Engineering team. The ideal candidate will have a strong background in semiconductor manufacturing, with expertise in Front End, Post Wafer Fabrication, and High Bandwidth Memory Technology.

Key Responsibilities:

  • Lead the development and optimization of Advance Packaging processes, equipment, and materials.
  • Manage and direct a high-performing team to achieve functional objectives.
  • Collaborate with cross-functional teams to understand needs and translate them into actionable plans, deliverables, and resource requirements.
  • Drive and implement global initiatives with global teams.

Required Skills and Qualifications:

We are looking for a candidate with:

  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
  • At least 8 years of experience in semiconductor manufacturing on leadership capacity.
  • Proven track record of technical leadership in semiconductor manufacturing, with expertise in Front End, PWF, HBM technology, process development, and/or equipment management.
  • Strong leadership and vision, with ability to comfortably work across organizational boundaries and geographies.

Benefits:

Our company offers a competitive salary, benefits package, and opportunities for professional growth and development.

How to Apply:

If you are a motivated and results-driven individual with a passion for innovation and leadership, please submit your application today.



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