Advanced Packaging Die Level Technology Engineering Leader
4 days ago
Advanced Packaging Die Level Technology Engineering Leader
Job Summary:
The Advanced Packaging Die Level Technology Engineering Leader will be responsible for leading a team of engineers to develop and deploy advanced packaging technologies.
Key Responsibilities:
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking.
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
- Establish and improve process management projects to deliver technology node requirements.
Requirements:
To succeed in this role, you should have a B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
About Micron Technology:
Micron Technology is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands.
Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
-
Singapore Micron Technology Full timeJoin to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...
-
Singapore Micron Technology Full timeJoin to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...
-
Singapore Micron Technology Full timeJoin to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...
-
Die Level Technology Specialist
2 days ago
Singapore beBeePackaging Full timeAdvanced Packaging Die Level Technology RoleOur organization is currently seeking an expert in Advanced Packaging Die Level Technology. This role involves driving the development of high-performance memory products. The ideal candidate will have a strong understanding of packaging technology and be able to collaborate effectively with cross-functional teams.
-
Singapore Micron Technology Full timePrincipal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...
-
Singapore Micron Technology Full timeSenior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly page is loaded Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76649 Our vision is to transform how...
-
Singapore Micron Technology Full timeSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loadedSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / GrindingApply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640Our vision is to...
-
Singapore Micron Technology Full timePrincipal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...
-
Advanced Packaging Engineer
2 days ago
Singapore beBeePackaging Full time $150,000 - $220,000Job TitleWe are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Roles & ResponsibilitiesLead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and plan by working with unit process...
-
Engineer Advanced Packaging Solutions
21 hours ago
Singapore beBeeEngineering Full timeJob Title: Multi-Layer Stacking Engineer Drive next-generation multi-layer stacking for hybrid bonding development. Key Responsibilities: Develop advanced packaging solutions needed in product lines such as multi-die stacking, fine pitch hybrid bonding. Plan and execute process integration and planning to enable new capability planning, early product...
