Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering
1 day ago
Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering
Join to apply for the
Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering
role at
Micron Technology
Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering
1 week ago Be among the first 25 applicants
Join to apply for the
Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering
role at
Micron Technology
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Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron's vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
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Singapore Micron Technology Full timeJoin to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...
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Singapore beBeePackaging Full time $180,000 - $250,000Job Title: Advanced Packaging Wafer Level Technology ExpertWe are seeking an accomplished professional to lead the development and implementation of advanced wafer level packaging technology.This innovative field is at the forefront of memory and compute advancements, driving progress in artificial intelligence (AI) applications.Micron's Advanced Packaging...
