Senior/ Engineer, Advanced Packaging Wafer Level Technology
2 days ago
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly page is loaded
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly
Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76649Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron's vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
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Singapore Micron Technology Full timePrincipal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...
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Singapore Micron Technology Full timeSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loadedSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / GrindingApply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640Our vision is to...
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Singapore beBeePackaging Full time $180,000 - $250,000Job Title: Advanced Packaging Wafer Level Technology ExpertWe are seeking an accomplished professional to lead the development and implementation of advanced wafer level packaging technology.This innovative field is at the forefront of memory and compute advancements, driving progress in artificial intelligence (AI) applications.Micron's Advanced Packaging...
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Singapore Micron Technology Full timeJoin to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...
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Singapore Micron Technology Full timePrincipal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...
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Senior Packaging Engineer
2 weeks ago
Singapore beBeeEngineering Full timeJob SummarySeeking an experienced and skilled engineer to establish new processes and tooling capabilities for advanced packaging technologies. The ideal candidate will have expertise in wafer-level packaging, material selection, and equipment benchmarking.About the RoleWe are looking for a talented engineer to lead the development of new process and...
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Singapore Micron Technology Full timePrincipal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer,...
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Singapore Micron Technology Full timeJoin to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...
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Singapore beBeeEngineering Full timeJob Title:Advanced Packaging Die Level Technology Engineering LeaderJob Summary:The Advanced Packaging Die Level Technology Engineering Leader will be responsible for leading a team of engineers to develop and deploy advanced packaging technologies.Key Responsibilities:Develop and optimize assembly processes for advanced packaging technologies, including...
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Singapore Micron Technology Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
