Advanced Packaging Engineer

14 hours ago

Singapore beBeePackaging Full time $150,000 - $220,000
Job Title

We are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.

Roles & Responsibilities
  • Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and plan by working with unit process engineers, manufacturing engineers, as well as directly with tools & materials for fabs.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and reduce cycle time & costs.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.
Required Skills & Qualifications
  • Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 12 years of prior related work experience.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.
Benefits
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.
Others

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Take part in hiring of other Advanced Packaging team members.

Mentor and guide new hires to assume their roles and responsibilities.

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