Advanced Packaging Solutions Engineer

2 weeks ago

Singapore beBeeIntegration Full time $180,000 - $250,000
About the Role

We are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.

This position will lead process development efforts for advanced packaging solutions, collaborating with unit process engineers, manufacturing engineers, and vendors. The successful candidate will develop expertise in processes, materials, and tooling, driving end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.

Responsibilities
  • Lead 3DHI process development efforts for building blocks required for advanced packaging solutions.
  • Drive end-to-end process integration and planning to enable new capability planning.
  • Develop expertise in processes, materials, and tooling.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between Product Line/Fab teams and customers.
Requirements
  • Masters degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field.
  • MS degree with at least 12 years of prior related work experience.
  • Language fluency - English (written & verbal).
  • Travel - up to 20%.
Preferred Qualifications
  • PhD education level preferred with at least 10 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills.
  • Strong written and verbal communication skills.

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