Advanced Packaging Solutions Developer

Job Description:The role of Advanced Packaging Integration Engineer is crucial in the development of high-performance memory products. The successful candidate will be responsible for designing and implementing advanced packaging solutions that meet the evolving needs of our customers.Required Skills and Qualifications:Proven expertise in advanced packaging...

About the RoleWe are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.This position will lead process development efforts for advanced packaging solutions, collaborating with unit process engineers, manufacturing engineers, and vendors. The successful...

Role Overview:The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in Singapore. This position will be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process...

**About**GlobalFoundries** **Introduction**: We are looking for an experience Engineer in Semiconductor Advanced Packaging. You will be the technical lead in the development, optimization, and implementation of advanced packaging technologies, ensuring high yield, quality, and reliability in semiconductor manufacturing. Additionally, you will establish and...

Advanced Packaging Technology Development EngineerWe are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies.Micron's Advanced Packaging Technology Development (APTD) is...

Director, Advanced Packaging Technology Development page is loaded Director, Advanced Packaging Technology Development Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76673Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing:...

Advanced Packaging Technology Development Leadership RoleThis is a critical position in our organization, requiring a leader to spearhead strategic packaging initiatives for high-performance products.The ideal candidate will possess strong technical expertise, effective communication skills, and the ability to collaborate with internal and external partners...

3D Heterogeneous Integration EngineerThe ideal candidate will be a seasoned expert in driving thermal solutions for next-generation hybrid bonding development.Key Responsibilities:Lead 3DHI process development efforts to establish thermal solutions required for advanced packaging solutions.Drive end-to-end process integration and planning to enable new...

Overview: - **WHAT YOU DO AT AMD CHANGES EVERYTHING** We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded....

Job Description:We are seeking a highly skilled R&D Engineer to lead the development of advanced packaging solutions for next-generation hybrid bonding. As a key member of our team, you will drive the design and implementation of thermal solutions that enable the creation of complex integrated circuits.Key Responsibilities:Develop and implement new process...