Advanced Packaging Solutions Specialist

2 weeks ago

Singapore beBeeThermosolutions Full time $180,000 - $250,000
3D Heterogeneous Integration Engineer

The ideal candidate will be a seasoned expert in driving thermal solutions for next-generation hybrid bonding development.

Key Responsibilities:
  • Lead 3DHI process development efforts to establish thermal solutions required for advanced packaging solutions.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.
  • Develop expertise in processes, materials, and tooling leveraging available characterization resources.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.

Additional responsibilities include performing all activities in a safe and responsible manner, supporting Environmental, Health, Safety & Security requirements, and participating in hiring and mentoring other team members.

Requirements:
  • Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field from an accredited degree program.
  • MS degree with at least 10 years of prior related work experience.
  • Language fluency in English (written and verbal).
  • Travel: up to 20%.

Preferred qualifications include PhD education level with at least 8 years of prior related work experience, demonstrated prior leadership experience, project management skills, strong written and verbal communication skills, and strong planning and organizational skills.

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