Advanced Packaging Solutions Expert

2 weeks ago


Singapore beBeePackaging Full time $90,000 - $120,000
Job Opportunity

Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.

The role spans from early-stage process development through to manufacturing. Key responsibilities include:

  • Developing and implementing advanced packaging processes
  • Collaborating with cross-functional teams to ensure seamless integration of D2W and W2W bonding solutions
  • Leveraging expertise in material science and device physics to optimize packaging performance

A successful candidate will possess:

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field
  • Minimum 5 years of experience in development integration engineering
  • Strong background in CMOS technology and packaging design

Benefits include:

  • Opportunity to work with cutting-edge technologies and innovative companies
  • Competitive salary and benefits package
  • Professional growth and development opportunities

Please submit your resume and cover letter to apply for this exciting opportunity.



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