
Advanced Packaging Solutions Expert
2 weeks ago
Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.
The role spans from early-stage process development through to manufacturing. Key responsibilities include:
- Developing and implementing advanced packaging processes
- Collaborating with cross-functional teams to ensure seamless integration of D2W and W2W bonding solutions
- Leveraging expertise in material science and device physics to optimize packaging performance
A successful candidate will possess:
- Bachelor's degree in Electrical Engineering, Materials Science, or related field
- Minimum 5 years of experience in development integration engineering
- Strong background in CMOS technology and packaging design
Benefits include:
- Opportunity to work with cutting-edge technologies and innovative companies
- Competitive salary and benefits package
- Professional growth and development opportunities
Please submit your resume and cover letter to apply for this exciting opportunity.
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