
Advanced Packaging Solutions Developer
6 days ago
Expert in Advanced Packaging Process Integration needed for a research and development role. Develop integrated process modules to enable cutting-edge packaging solutions. Work with various teams to bring technologies from concept to mass production.
Key Responsibilities:
- Conduct gap-analysis, risk-assessment and mitigation, and integration process flow development
- Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging
- Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process
- Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data
- Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps
Required Skills and Qualifications:
- Around 10 years of hands-on experience in semiconductor technology and processing
- Deep knowledge of semiconductor technology and processing
- Knowledge of Advanced Packaging architecture and process flow
- Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process
- Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs
- Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions
- Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering
About the Job:
- Work Location: Science Park II
Tell employers what skills you have
Metrology
Packaging
Assembly
Data Analysis
Molding
Grinding
Process Integration
Reliability
Research and Development
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