Advanced Packaging Solutions Developer

1 week ago

Singapore beBeePackaging Full time $120,000 - $180,000
Job Title: Multi-Layer Stacking Engineer

Drive innovation in next-generation multi-layer stacking for hybrid bonding development.

Key Responsibilities:

  • Develop advanced packaging solutions needed in product lines such as multi-die stacking, fine pitch hybrid bonding.
  • Plan and execute process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in processes, materials and tooling leveraging available characterization resources.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
  • Understand failure modes and facilitate interactions between product line/fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.

Qualifications:

  • Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field.
  • 12 years of prior related work experience, MS degree required.
  • Overall GPA 3.0 and proven good academic standing.
  • Language Fluency - English (written & verbal).
  • Travel up to 20%.

Preferred Qualifications:

  • PhD education level preferred with at least 10 years of prior related work experience.
  • Leadership experience in the workplace, school projects, competitions.
  • Project management skills.
  • Strong written and verbal communication skills.
  • Planning & organizational skills.

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