Advanced Packaging Solutions Specialist

2 weeks ago

Singapore beBeePackaging Full time $120,000 - $200,000
Job Title: Advanced Packaging Solutions Specialist

Job Summary:

We are seeking an experienced Advanced Packaging Solutions Specialist to drive thermal solutions for next-generation hybrid bonding development.


Key Responsibilities:
  • Lead process development efforts for establishing thermal solutions required for advanced packaging solutions needed in product lines (e.g., multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with unit process engineers, manufacturing engineers, as well as directly with tools & materials for semiconductor fabs.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs.
  • Develop expertise in processes, materials, and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and reduce cycle time & costs.
  • Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.

Requirements:
  • Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 10 years of prior related work experience.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.

Preferred Qualifications:
  • Education – PhD education level preferred with at least 8 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.

What We Offer:
  • Competitive compensation package.
  • Opportunity to work with a global leading full-service semiconductor foundry.
  • Collaborative and dynamic work environment.
  • Professional growth and development opportunities.

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