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Advanced Packaging Solutions Specialist

2 weeks ago

Singapore beBeeIntegration Full time $120,000 - $200,000
About the Job:

The role of Integration Specialist is open at a leading semiconductor foundry.

As an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer, you will drive thermal solutions for next-generation hybrid bonding development. You will lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions needed in product lines. Your responsibilities include planning with unit process engineers, manufacturing engineers, and working directly with tools & materials for GF fabs.

Your Key Responsibilities:
  • Develop integration schemes to continuously improve yields and reduce cycle time & costs.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.


Requirements:
  • Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 10 years of prior related work experience.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.


What We Offer:
  • We offer a competitive compensation package that includes annual salary reviews.
  • A comprehensive health insurance plan.
  • Generous retirement plan.
  • Professional development opportunities.


How to Apply:

You can apply for this position by visiting our website and searching for job openings. Please ensure your application includes your resume, cover letter, and any other required documents.