Mts Advanced Packaging

2 weeks ago

Singapore GLOBALFOUNDRIES Full time

**About**GlobalFoundries**

**Introduction**:
We are looking for an experience Engineer in Semiconductor Advanced Packaging. You will be the technical lead in the development, optimization, and implementation of advanced packaging technologies, ensuring high yield, quality, and reliability in semiconductor manufacturing. Additionally, you will establish and provide training programs for the Advance packaging Team.

**Your Job**:

- You will be responsible for the overall technology development, management and direction of Advanced Packaging process, equipment and materials definition, development and/or optimization.
- **Advanced Packaging Solutions**:drive experimental validation and characterization of advanced packaging solutions such as 2.5/3D CoWoS and DoW/WoW.
- **Technology & Product Roadmap enablement**:define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps.
- **Strategic Partnerships**:cultivate strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources.
- **Data Collection & Analysis**: lead collaborations with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (partners, OSATs, suppliers, universities) for data collection and analysis.
- **Technical Leadership**:provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians.


**Other Responsibilities**:

- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

**Required Qualifications**:

- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 5+ years of experience in Advanced packaging, metrology, characterization, design validation of components, packages, and platforms.
- Drive experimental validation and characterization of advanced packaging solutions such as TSV, WoW, DoW, Si bridge technologies.
- Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing and spectroscopy (EDS, FTIR, XRF).
- Experience with data collection and analysis, including statistical methods.
- Demonstrated ability to work independently and in a team environment.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

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