Advanced Packaging Solutions Expert

3 days ago

Singapore beBeePackaging Full time $150,000 - $250,000
Job Description

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.

  • Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and planning by working with unit process engineers, manufacturing engineers, as well as directly with tools & materials for GF Singapore semiconductor fabs.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.
  • Drive understanding of failure modes.
  • Facilitate advanced packaging interactions between GF Singapore Product Line/Fab teams and customers.
  • Generate IP related to novel wafer integration & packaging technology.
Required Skills & Qualifications

Education: Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.

Work Experience: MS degree with at least 12 years of prior related work experience.

Language Fluency: English (Written & Verbal).

Travel: Up to 20%.

Benefits

Perks of this job include strong written and verbal communication skills, project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong planning & organizational skills are also highly desirable.

Others

This role requires collaboration with vendors and OSATs to develop new technologies, continuous improvement of yields and reduction of cycle time & costs, and facilitating advanced packaging interactions between teams and customers.

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