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R&D Engineer

2 weeks ago

Singapore beBeePackaging Full time $200,000 - $240,000

Job Description:

We are seeking a highly skilled R&D Engineer to lead the development of advanced packaging solutions for next-generation hybrid bonding. As a key member of our team, you will drive the design and implementation of thermal solutions that enable the creation of complex integrated circuits.

Key Responsibilities:

  • Develop and implement new process technologies for 3D heterogeneous integration (3DHI) and fine pitch hybrid bonding.
  • Collaborate with cross-functional teams to integrate and qualify new processes and materials.
  • Work with vendors and outsourced assembly and test (OSAT) partners to develop new wafer-level and die-level processes.
  • Identify and address technical challenges and failures in the development process.

Requirements and Qualifications:

  • Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field.
  • Minimum of 5 years of experience in a related field, with a strong background in semiconductor processing and packaging.
  • Proven track record of innovation and leadership in the field of advanced packaging.
  • Excellent communication and collaboration skills.

Preferred Qualifications:

  • Ph.D. education level in a relevant field.
  • Strong project management and organizational skills.
  • Experience with advanced simulation tools and methodologies.
  • Publication record in reputable scientific journals and conferences.