Senior Director, Advanced Packaging Engineering

2 weeks ago


Singapore beBeePackaging Full time

We are seeking a seasoned Senior Director to lead our Advanced Packaging Engineering team. This highly visible role will require strong technical leadership skills and the ability to drive innovation in advanced packaging technologies.

The successful candidate will have a deep understanding of post-fabrication wafer finishing and experience in developing high-performance and cost-effective packaging solutions. They will be responsible for collaborating with internal and external partners to develop and implement strategies aligned to organizational objectives.

  • Develop and communicate advanced packaging technology development strategy
  • Provide technical leadership and influence company direction
  • Cultivate cross-functional relationships to drive multi-functional initiatives
  • Mentor engineers and engage in continued learning to stay updated with latest advancements

The ideal candidate will possess a Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related fields. They should also have 8+ years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control, and packaging.

A strong track record of problem-solving, effective communication, and presentation skills is essential. The ability to multitask, manage multiple projects, and work effectively under timelines and limited resources is also required.

This is an exciting opportunity for a senior leader to make a significant impact on our organization's success.

In addition to a competitive salary and benefits package, we offer a dynamic and inclusive work environment that fosters growth and collaboration.



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