Senior Advanced Package Technology Engineer

2 days ago


Singapore beBeeIntegration Full time $180,000 - $250,000
Advanced Package Metrology-Real-Time Defect Analysis

This role focuses on driving yield improvements, reducing costs, and enhancing productivity through advanced package technology development.

Key Responsibilities:
  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
  • Achieve and improve yields through silicon package integration innovation.
  • Evaluate process flows and interactions to integrate semiconductors while partnering with process and product engineering teams.
Requirements:
  • Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Materials Science, or related field.
  • Passion for semiconductor process integration and strong problem-solving skills.
  • Familiarity with process flows, interactions, and ability to integrate semiconductors.
Benefits:
  • Opportunity to work on cutting-edge technology development projects.
  • Collaborative environment with cross-functional teams.
  • Professional growth and development opportunities.

The ideal candidate will possess a strong background in electrical engineering, mechanical engineering, or a related field, along with excellent problem-solving skills and the ability to work effectively under timelines and limited resources.



  • Singapore Micron Technology Full time

    Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...


  • Singapore Micron Technology Full time

    Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly page is loaded Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76649 Our vision is to transform how...


  • Singapore Micron Technology Full time

    Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...


  • Singapore Micron Technology Full time

    Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...


  • Singapore Micron Technology Full time

    Principal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/...


  • Singapore Micron Technology Full time

    Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding page is loadedSenior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / GrindingApply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76640Our vision is to...


  • Singapore Micron Technology Full time

    Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering 6 days ago Be among the first 25 applicants Join to apply for the Principal/ Senior/ Engineer,...


  • Singapore Micron Technology Full time

    Principal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer,...


  • Singapore Micron Technology Full time

    Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...


  • Singapore Micron Technology Full time

    Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...