R&D Director

1 day ago


Singapore beBeePackaging Full time $200,000 - $250,000

Lead Advanced Packaging Innovator

We seek a visionary leader to spearhead our advanced packaging research and development efforts.

This strategic role will drive innovation, develop cutting-edge technologies, and ensure the successful commercialization of these solutions.

Main Responsibilities

  1. Develop and Execute R&D Strategy: Create and implement a comprehensive research and development plan for advanced packaging solutions, aligning with business objectives and industry trends.
  2. Lead End-to-End Development: Oversee the entire product lifecycle, from concept to prototyping, validation, and commercialization of advanced packaging technologies.
  3. Collaborate with Cross-Functional Teams: Foster collaboration with internal stakeholders to ensure seamless technology transfer and adoption.
  4. Drive Research and Development: Drive cutting-edge research to develop novel materials, processes, and equipment for advanced packaging solutions.
  5. Partner with External Organizations: Partner with universities and research institutions to stay at the forefront of technological advancements.
  6. Evaluate Emerging Trends: Assess emerging trends in semiconductor manufacturing and packaging, such as chiplet architectures and AI-driven packaging solutions.
  7. Build and Lead High-Performing Team: Develop, mentor, and lead a high-performing team of engineers and researchers.
  8. Foster Innovation Culture: Encourage a culture of innovation, collaboration, and continuous learning within the team.
  9. Cultivate Customer Relationships: Engage with key customers to understand their requirements and translate them into innovative solutions.
  10. Establish Strategic Partnerships: Establish partnerships with semiconductor manufacturers and ecosystem players to drive technology adoption.
  11. Develop Intellectual Property Strategy: Develop and manage intellectual property strategy by filing patents and securing leadership in advanced packaging technologies.

Required Skills and Qualifications

  1. Ph.D. or Master's Degree: Hold a Ph.D. or Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
  2. Leadership Experience: Possess a minimum of 15 years of experience in semiconductor packaging R&D, with at least 5 years in a leadership role.
  3. Advanced Packaging Expertise: Demonstrate deep expertise in advanced packaging technologies.
  4. Technical Knowledge: Possess strong knowledge of semiconductor materials, bonding techniques, and reliability testing.
  5. Proven Track Record: Showcase a proven track record of bringing new packaging technologies from R&D to mass production.
  6. Global Collaboration: Have experience working with global teams and external research partners.
  7. Strategic Leadership: Exhibit excellent leadership, communication, and strategic planning skills.

Benefits

The ideal candidate will have the opportunity to lead a talented team of engineers and researchers, driving innovation and advancing the state-of-the-art in semiconductor packaging.


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