
R&D Director
1 day ago
Lead Advanced Packaging Innovator
We seek a visionary leader to spearhead our advanced packaging research and development efforts.
This strategic role will drive innovation, develop cutting-edge technologies, and ensure the successful commercialization of these solutions.
Main Responsibilities
- Develop and Execute R&D Strategy: Create and implement a comprehensive research and development plan for advanced packaging solutions, aligning with business objectives and industry trends.
- Lead End-to-End Development: Oversee the entire product lifecycle, from concept to prototyping, validation, and commercialization of advanced packaging technologies.
- Collaborate with Cross-Functional Teams: Foster collaboration with internal stakeholders to ensure seamless technology transfer and adoption.
- Drive Research and Development: Drive cutting-edge research to develop novel materials, processes, and equipment for advanced packaging solutions.
- Partner with External Organizations: Partner with universities and research institutions to stay at the forefront of technological advancements.
- Evaluate Emerging Trends: Assess emerging trends in semiconductor manufacturing and packaging, such as chiplet architectures and AI-driven packaging solutions.
- Build and Lead High-Performing Team: Develop, mentor, and lead a high-performing team of engineers and researchers.
- Foster Innovation Culture: Encourage a culture of innovation, collaboration, and continuous learning within the team.
- Cultivate Customer Relationships: Engage with key customers to understand their requirements and translate them into innovative solutions.
- Establish Strategic Partnerships: Establish partnerships with semiconductor manufacturers and ecosystem players to drive technology adoption.
- Develop Intellectual Property Strategy: Develop and manage intellectual property strategy by filing patents and securing leadership in advanced packaging technologies.
Required Skills and Qualifications
- Ph.D. or Master's Degree: Hold a Ph.D. or Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
- Leadership Experience: Possess a minimum of 15 years of experience in semiconductor packaging R&D, with at least 5 years in a leadership role.
- Advanced Packaging Expertise: Demonstrate deep expertise in advanced packaging technologies.
- Technical Knowledge: Possess strong knowledge of semiconductor materials, bonding techniques, and reliability testing.
- Proven Track Record: Showcase a proven track record of bringing new packaging technologies from R&D to mass production.
- Global Collaboration: Have experience working with global teams and external research partners.
- Strategic Leadership: Exhibit excellent leadership, communication, and strategic planning skills.
Benefits
The ideal candidate will have the opportunity to lead a talented team of engineers and researchers, driving innovation and advancing the state-of-the-art in semiconductor packaging.
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