R&d Director

2 days ago

Singapore ASMPT SINGAPORE PTE. LTD. Full time

**R&D Director**

**Responsibilities**:

- Define and execute the R&D strategy for Advanced Packaging solutions, aligning with business objectives and market trends.
- Lead the end-to-end development of advanced packaging technologies (e.g., Fan-Out, 2.5D/3D integration, Heterogeneous Integration, Flip-Chip, and Wafer-Level Packaging).
- Oversee the entire product development lifecycle, from concept to prototyping, validation, and commercialization.
- Collaborate with cross-functional teams, including Product Management, Engineering, and Manufacturing, to ensure smooth technology transfer.
- Innovation & ResearchDrive cutting-edge research to develop novel materials, processes, and equipment for advanced packaging.
- Partner with universities, research institutes, and industry consortia to stay at the forefront of technology advancements.
- Evaluate emerging trends such as chiplet architectures, hybrid bonding, and AI-driven packaging solutions.
- Build, mentor, and lead a high-performing R&D team of engineers and developers
- Foster a culture of innovation, collaboration, and continuous learning.
- Engage with key customers to understand requirements and translate them into innovative solutions.
- Establish partnerships with semiconductor manufacturers, OSATs, and ecosystem players to drive technology adoption.
- IP & Patent Portfolio ManagementDrive intellectual property (IP) strategy by filing patents and securing ASMPT’s leadership in Advanced Packaging technologies.

**Qualifications & Experience**:

- Min. Ph.D. or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum 15 years of experience in semiconductor packaging R&D, with at least 5 years in a leadership role.
- Deep expertise in Advanced Packaging technologies (e.g., Fan-Out, 3D IC, Hybrid Bonding, System-in-Package).
- Strong knowledge of semiconductor materials, bonding techniques, and reliability testing.
- Proven track record of bringing new packaging technologies from R&D to mass production.
- Experience working with global teams and external research partners.
- Excellent leadership, communication, and strategic planning skills.

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