Advanced Packaging Specialist

3 days ago


Singapore beBeeThermal Full time

Thermal Solutions Engineer

About Our Client:

We are seeking an experienced Thermal Solutions Engineer to drive the development of advanced packaging solutions for next-generation hybrid bonding.

The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning. They will be responsible for leading 3D Heterogeneous Integration (3DHI) process development efforts, working closely with unit process engineers, manufacturing engineers, and tools & materials teams.

Key Responsibilities:

  • Develop thermal solutions for advanced packaging applications
  • Lead 3DHI process development efforts
  • Work with cross-functional teams to integrate new processes and technologies
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes
  • Facilitate interactions between fab teams and customers

Requirements:

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field
  • MS degree with at least 10 years of prior related work experience
  • Language Fluency - English (Written & Verbal)

Preferred Qualifications:

  • PhD education level preferred with at least 8 years of prior related work experience
  • Demonstrated prior leadership experience
  • Project management skills


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