
Advanced Packaging Specialist
3 days ago
A skilled Laser Bonding Engineer is required to develop and maintain advanced packaging processes for high-precision, high-reliability applications. The ideal candidate will have expertise in laser-assisted bonding processes and a strong understanding of semiconductor process engineering.
">Key Responsibilities
- ">
- Develop and optimize laser bonding processes for product packaging and advanced interconnects;">
- Qualify new processes from R&D to high-volume production;">
- Specify and program laser bonder equipment and processes;">
- Troubleshoot laser systems and bonding processes;">
- Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies.">
Requirements
- ">
- Strong background in semiconductor process engineering and laser-assisted bonding processes;">
- Expertise in developing and optimizing laser bonding processes;">
- Ability to work with cross-functional teams and communicate effectively;">
- Strong analytical and problem-solving skills;">
- Proficiency in data analysis and statistical process control.">
What We Offer
- ">
- A dynamic and challenging work environment;">
- Opportunities for professional growth and development;">
- A competitive salary and benefits package.">
-
Advanced Semiconductor Packaging Specialist
3 days ago
Singapore beBeePackaging Full timeJob Title: Advanced Semiconductor Packaging SpecialistLocation: Admiralty Street, SingaporeJob Description:We are seeking an experienced Advanced Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing innovative packaging solutions for semiconductor devices.Key Responsibilities:Design...
-
Advanced Packaging Process Specialist
2 days ago
Singapore beBeeLaserBonding Full time $6,000 - $8,000Advanced Packaging Process SpecialistWe are seeking a skilled professional to develop and optimize laser bonding processes for high-precision applications.About the Role:Create, implement, and refine laser-assisted bonding processes for product packaging and advanced interconnects.Qualify new laser bonding processes from R&D to high-volume production,...
-
Mts Ic-advance Packaging Design Engineer
2 weeks ago
Singapore Advanced Micro Devices, Inc Full timeOverview: - **WHAT YOU DO AT AMD CHANGES EVERYTHING** We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded....
-
Advanced Package Metrology Specialist
3 days ago
Singapore beBeePackaging Full timeJob DescriptionAs a specialist in advanced package metrology, you will play a pivotal role in driving technology development and improving product quality.Develop and enable innovative package technologies for post-fab wafer finish and assembly processes to enhance productivity and reduce costs.Achieve and improve yields through silicon package integration...
-
Advanced Packaging Specialist
2 days ago
Singapore beBeePackaging Full time $100,000 - $120,000We are seeking a seasoned Packaging Technologist to spearhead the development of cutting-edge packaging solutions for high-performance electronic devices. As a trusted member of our team, you will leverage your expertise in semiconductor process development to drive innovation and efficiency across multiple projects.Key Responsibilities:Collaborate with...
-
Advanced Packaging Solutions Specialist
3 days ago
Singapore beBeeIntegration Full timeJob Description:The role of Advanced Packaging Integration Engineer is crucial in the development of high-performance memory products. The successful candidate will be responsible for designing and implementing advanced packaging solutions that meet the evolving needs of our customers.Required Skills and Qualifications:Proven expertise in advanced packaging...
-
Advanced Packaging Technologist
3 days ago
Singapore beBeeInnovation Full timeAdvanced Packaging Technology Development EngineerWe are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies.Micron's Advanced Packaging Technology Development (APTD) is...
-
Advanced Packaging Integration Specialist
4 days ago
Singapore beBeeInnovator Full time $180,000 - $250,000Job SummaryWe are looking for a talented Advanced Packaging Integration Engineer to join our team in delivering cutting-edge package development for high-performance memory products.This is an exciting opportunity for a motivated individual who can drive innovation, improve product quality, and enhance productivity.Key Responsibilities:Develop and enable...
-
Advanced Semiconductor Packaging Specialist
24 hours ago
Singapore beBeeEngineer Full timeJob Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...
-
Advanced Packaging Engineer
2 days ago
Singapore beBeePackaging Full time $150,000 - $220,000Job TitleWe are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Roles & ResponsibilitiesLead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and plan by working with unit process...