
Advanced Packaging Process Specialist
1 day ago
We are seeking a skilled professional to develop and optimize laser bonding processes for high-precision applications.
About the Role:
- Create, implement, and refine laser-assisted bonding processes for product packaging and advanced interconnects.
- Qualify new laser bonding processes from R&D to high-volume production, ensuring seamless transitions.
- Specify, program, and fine-tune laser bonder equipment and processes for maximum efficiency.
- Troubleshoot complex laser systems and bonding processes, leveraging data-driven methodologies to drive improvements.
- Collaborate closely with R&D, operations, maintenance, and quality teams to ensure alignment and excellence.
Requirements:
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- A minimum of 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging processes.
- Prior experience with Laser Assisted bonding technologies is highly beneficial.
- Familiarity with bonding equipment and analytical tools is essential.
- Strong trouble-shooting, risk analysis, FMEA, and statistical analysis skills are required.
- In-depth knowledge of bonding process and materials behavior under thermal/mechanical stress is necessary.
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