Advanced Semiconductor Packaging Specialist

Job Title: Advanced Semiconductor Packaging SpecialistLocation: Admiralty Street, SingaporeJob Description:We are seeking an experienced Advanced Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing innovative packaging solutions for semiconductor devices.Key Responsibilities:Design...

Advanced Semiconductor Packaging SpecialistThe role of a semiconductor packaging specialist is to design, develop and optimize advanced semiconductor packages. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key Responsibilities:Design innovative semiconductor...

Software Development Opportunity As a skilled Software Developer, you will design and implement software solutions for advanced packaging semiconductor equipment. This role involves developing high-performance software to enhance automation, control, and data processing for semiconductor manufacturing. Key Responsibilities: Design, develop, and...

Software EngineerWe are seeking a skilled Software Engineer to fill this key role. The successful candidate will be responsible for developing and optimizing software for advanced packaging semiconductor equipment.Key Responsibilities:Create and maintain software for motion control, data acquisition, and process automation.Collaborate with hardware and...

Job Title: TCB Module Development SpecialistA TCB module development specialist is responsible for designing, developing and optimizing Thermo-Compression Bonding (TCB) modules used in advanced semiconductor packaging.This role requires a strong understanding of thermal control and bonding processes, as well as the ability to collaborate with...

**TCB Design Engineer Role Overview**A key contributor to our team is required to design, develop, and optimize TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging.This critical role ensures precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process...

Key ResponsibilitiesWe are seeking a skilled engineer to design, develop and optimize TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Must-have:Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings,...

Job Title: Laser Bonding Engineer">A skilled Laser Bonding Engineer is required to develop and maintain advanced packaging processes for high-precision, high-reliability applications. The ideal candidate will have expertise in laser-assisted bonding processes and a strong understanding of semiconductor process engineering.">Key Responsibilities">Develop and...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...

We are seeking a seasoned Packaging Technologist to spearhead the development of cutting-edge packaging solutions for high-performance electronic devices. As a trusted member of our team, you will leverage your expertise in semiconductor process development to drive innovation and efficiency across multiple projects.Key Responsibilities:Collaborate with...