Advanced Semiconductor Packaging Specialist
3 days ago
A key contributor to our team is required to design, develop, and optimize TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging.
This critical role ensures precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
**Key Responsibilities**- Design & Development:
- Develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
- Plan, schedule, and cost machines and modules.
- Prototyping & Testing:
- Oversee the fabrication of prototype modules and their integration with TCB platforms.
- Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support:
- Collaborate with electrical, vision, and software engineers for machine integration.
- Collaborate with the process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).
- Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
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