Advanced Semiconductor Packaging Engineer

1 day ago

Singapore beBeeThermal Full time $90,000 - $120,000

Job Title: TCB Module Development Specialist

A TCB module development specialist is responsible for designing, developing and optimizing Thermo-Compression Bonding (TCB) modules used in advanced semiconductor packaging.

This role requires a strong understanding of thermal control and bonding processes, as well as the ability to collaborate with cross-functional teams to improve machine integration and manufacturing efficiency.

  • Key Responsibilities:
  • Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  • Responsible for 3D design and 2D drawings, bill of materials management, failure mode effect analysis, error budgeting, and design for manufacturability and assembly.
  • Plan, schedule, and cost machine modules.
  • Prototype and test TCB modules.
  • Oversee fabrication of prototype modules and their integration with TCB platforms.
  • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Collaborate with electrical, vision, and software engineers for machine integration.
  • Work with the process team to improve the bonding machine.
  • Collaborate with manufacturing engineers to ensure design for manufacturability and safe, robust assembly of module systems.

Requirements:

  • Strong understanding of thermal control and bonding processes.
  • Ability to design and develop innovative TCB module assemblies.
  • Excellent communication and collaboration skills.
  • Experience with 3D design and 2D drawings, bill of materials management, and design for manufacturability and assembly.
  • Ability to work effectively in a team environment.

Benefits:

  • Opportunity to work on cutting-edge technology.
  • Chance to contribute to the development of innovative solutions.
  • Collaborative and dynamic work environment.

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