Engineer, Advanced Package Metrology-Real-Time Defect Analysis
5 days ago
Technology Development:
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Integrate semiconductors while partnering with process and product engineering teams
Yield Improvement:
- Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
Quality Improvement:
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
- Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
- Passion and interest in semiconductor process integration.
- Know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes would be beneficial.
- Understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
- Ability to resolve complex issues through root-cause or model-based problem solving
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes.
- Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus
Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.
Tell employers what skills you haveYield Analysis
Technology Development
Quality Improvement
Defense
Process Integration
Physics
Manufacturing Processes
Product Engineering
Fabrication
Finish
Semiconductors
Assembly Processes
Customer Focus
Assembly
Silicon
Chemical Engineering
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