Advanced Semiconductor Packaging Specialist

Job Title: Advanced Semiconductor Packaging SpecialistLocation: Admiralty Street, SingaporeJob Description:We are seeking an experienced Advanced Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing innovative packaging solutions for semiconductor devices.Key Responsibilities:Design...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

Advanced Semiconductor Packaging SpecialistThe role of a semiconductor packaging specialist is to design, develop and optimize advanced semiconductor packages. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key Responsibilities:Design innovative semiconductor...

Software Development Opportunity As a skilled Software Developer, you will design and implement software solutions for advanced packaging semiconductor equipment. This role involves developing high-performance software to enhance automation, control, and data processing for semiconductor manufacturing. Key Responsibilities: Design, develop, and...

Job Title: TCB Module Development SpecialistA TCB module development specialist is responsible for designing, developing and optimizing Thermo-Compression Bonding (TCB) modules used in advanced semiconductor packaging.This role requires a strong understanding of thermal control and bonding processes, as well as the ability to collaborate with...

**TCB Design Engineer Role Overview**A key contributor to our team is required to design, develop, and optimize TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging.This critical role ensures precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process...

Process Optimization SpecialistWe are seeking an experienced Process Optimization Specialist to develop and optimize laser bonding processes for high-precision, high-reliability advanced packaging applications.Develop recipes and parameters to achieve maximum yield, quality, and throughput.Qualify new laser bonding processes from R&D to high-volume...

Key ResponsibilitiesWe are seeking a skilled engineer to design, develop and optimize TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Must-have:Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings,...

Job Title: Laser Bonding Engineer">A skilled Laser Bonding Engineer is required to develop and maintain advanced packaging processes for high-precision, high-reliability applications. The ideal candidate will have expertise in laser-assisted bonding processes and a strong understanding of semiconductor process engineering.">Key Responsibilities">Develop and...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...