Advanced Packaging Engineer

Job TitleWe are seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development.Roles & ResponsibilitiesLead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in product lines and plan by working with unit process...

Job Title:">Advanced Packaging Engineer">,Location:AdmiraltyWorking Hours:9:00am - 6:00pmSalary Range:$6000 - $8000As an Advanced Packaging Engineer, you will be responsible for developing and optimizing laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.Responsibilities:">Develop, implement, and optimize...

Advanced Packaging Equipment EngineeringWe are seeking a highly skilled and motivated equipment engineer to join our team in Singapore. This is an exciting opportunity to develop and optimize unit processes for advanced packaging.The primary responsibilities of this position include developing and optimizing processes for bond & Debond, pre-bond - Plasma /...

Advanced Packaging Die Level TechnologyWe are seeking a highly skilled and experienced engineer to join our team in the development of advanced packaging technology for high-performance memory products. The ideal candidate will have a strong background in electrical engineering, materials science, or a related field, with expertise in semiconductor...

Explore the world of advanced packaging and join our team of skilled professionals as a Metrology Engineer. Apply today to work with us in Singapore and be a part of shaping the future of technology.Metrology Engineers play a crucial role in ensuring the quality and reliability of our products. Your task will be to develop new metrology strategies, provide...

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...

We are seeking a skilled Process Engineer to join our team in developing, optimizing, and maintaining laser bonding processes for advanced packaging applications.About the RoleDevelop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.Qualify new laser bonding processes from R&D to...

Role Overview:The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in Singapore. This position will be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process...

Job Title Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power CMOS platforms.">Key Responsibilities:Develop and integrate advanced packaging processes for ULP CMOS platforms.Lead the development of D2W and W2W bonding...

Advanced Packaging Engineer">We are seeking a skilled Advanced Packaging Engineer to lead our advanced packaging process integration efforts. As part of our team, you will be responsible for developing and optimizing process flows and recipes for defect-free, high-reliability manufacturing.The ideal candidate will have a strong background in advanced...