Senior Advanced Packaging Engineer

1 day ago


Singapore beBeeAdvanced Full time $90,000 - $120,000
Advanced Packaging Die Level Technology

We are seeking a highly skilled and experienced engineer to join our team in the development of advanced packaging technology for high-performance memory products. The ideal candidate will have a strong background in electrical engineering, materials science, or a related field, with expertise in semiconductor manufacturing and process integration.

Key Responsibilities:
  • Develop and optimize advanced packaging solutions for high-bandwidth memory products
  • Collaborate with cross-functional teams to integrate new technologies and processes into production
  • Design and develop novel package architectures to improve performance, reduce power consumption, and enhance yield
  • Conduct experimental and simulation-based research to evaluate and validate new packaging concepts
  • Publish technical papers and present research findings at industry conferences
Requirements:
  • PhD in Electrical Engineering, Materials Science, or a related field
  • Minimum 5 years of experience in semiconductor manufacturing and process integration
  • Expertise in advanced packaging technologies, including 3D stacking and through-silicon vias (TSVs)
  • Strong understanding of semiconductor physics, materials science, and thermal management
  • Excellent communication and teamwork skills, with ability to collaborate with engineers, scientists, and technicians from diverse backgrounds
Benefits:

Our company offers a competitive salary, comprehensive benefits package, and opportunities for professional growth and development. We prioritize diversity, equity, and inclusion, and strive to create a workplace culture that values collaboration, innovation, and creativity.

Why Join Us?

At our company, we are passionate about pushing the boundaries of what is possible in semiconductor manufacturing and memory technology. We believe that innovation requires a collaborative and inclusive environment, where diverse perspectives and ideas can thrive. If you share our passion for advancing the state-of-the-art in packaging and memory technologies, and are committed to delivering exceptional results in a dynamic and fast-paced environment, we encourage you to apply for this exciting opportunity.



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