Advanced Packaging Solutions Engineer

2 days ago

Singapore beBeeRdEngineer Full time $220,000 - $280,000
Job Opportunity

At our company, we are seeking an experienced 3D Heterogeneous Integration R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.

The successful candidate will lead process development efforts for establishing thermal solutions required for advanced packaging solutions. This will involve working with unit process engineers, manufacturing engineers, and directly with tools & materials in our semiconductor fabs.

Key responsibilities include driving end-to-end process integration and planning to enable new capability planning, early product prototyping, and qualification across multiple programs. The engineer will also develop expertise in processes, materials, and tooling and leverage available characterization resources to improve yields and reduce cycle time & costs.

Additionally, the role involves collaborating with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes, understanding failure modes, and facilitating interactions between fab teams and customers. The successful candidate will also be responsible for generating IP related to novel wafer integration & packaging technology.

Other responsibilities include performing all activities in a safe and responsible manner and supporting Environmental, Health, Safety & Security requirements and programs. The engineer may also be involved in hiring and mentoring other team members and will take part in various other duties assigned by their manager.

To be eligible for this role, candidates must have a Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related field from an accredited degree program. A minimum of 10 years' work experience in a related field is required, as well as language fluency in English (written and verbal). Travel is expected to be up to 20% of the time.

Preferred qualifications include PhD education level, prior leadership experience, project management skills, strong written and verbal communication skills, and strong planning & organizational skills.

  • Management Skills
  • Integration
  • Materials Science
  • Process Integration
  • 3D
  • Fabrication
  • Environmental Health
  • Project Management
  • Characterization
  • IP
  • Packaging
  • Assembly
  • Manufacturing
  • Electrical Engineering
  • Chemical Engineering
  • Mechanical Engineering

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