Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering
10 hours ago
Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology
Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering6 days ago Be among the first 25 applicants
Join to apply for the Principal/ Senior/ Engineer, Advanced Packaging Equipment Engineering role at Micron Technology
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
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Singapore Micron Technology Full timePrincipal/Senior/ Engineer, Advanced Packaging Integration Engineering Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Integration Engineering role at Micron Technology Principal/Senior/ Engineer, Advanced Packaging Integration Engineering 1 week ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer,...
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Singapore GlobalFoundries Full timePrincipal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant) page is loaded## Principal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant)locations: Singaporetime type: Full timeposted on: Posted Yesterdayjob requisition id: JR- **Introduction to GlobalFoundries**GlobalFoundries (GF) is one of the world's...
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Singapore Micron Technology Full timePrincipal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...
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Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...
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Singapore Micron Technology Full timeJoin to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...
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Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeJob Description Responsibilities Equipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • Evaluate and promote new equipment...
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Senior Principal Engineer
2 weeks ago
Singapore KBR Full time**Title**: Senior Principal Engineer (Instrument Package Equipment Lead) Job Responsibilities Lead procurement activities for Equipment packages Be the Instrument discipline focal point for all coordination with Mechanical, Electrical, Safety, HVAC and other discipline package engineers Preparation of instrument requirement for Equipment packages,...
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Singapore GlobalFoundries Full timePrincipal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant) page is loaded## Principal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant)locations: Singaporetime type: Full timeposted on: Posted Yesterdayjob requisition id: JR- **Introduction to GlobalFoundries**GlobalFoundries (GF) is one of the world’s...
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Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeRoles & ResponsibilitiesJob DescriptionResponsibilitiesEquipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • ...
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Senior Principal Engineer
1 day ago
Singapore KBR Full time**Title**: Senior Principal Engineer (Instrumentation Package Equipment Lead) **Responsibilities**: - Lead procurement activities for Equipment packages **Responsibilities include**: - Be the Instrument discipline focal point for all co-ordination with Mechanical, Electrical, Safety, HVAC and other discipline package Engineers Preparation of instrument...
