Engineer, Advanced Packaging Equipment Engineering
1 day ago
Responsibilities
Equipment Development:
• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
Equipment Tactics:
• Evaluate and promote new equipment and materials to enhance process capabilities
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products. cost, availability, and improve hardware and process capability
Quality Improvement:
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
- Experience in semiconductor process or equipment engineering experience would be beneficial
- Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware would be beneficial
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes
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Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full timeRoles & ResponsibilitiesJob DescriptionResponsibilitiesEquipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • ...
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