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Advanced Semiconductor Packaging Specialist
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**Job Title:** Advanced Packaging Design Engineer – Thermo-Compression Bonding Systems
This is a challenging role that requires expertise in designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
The successful candidate will be responsible for creating innovative solutions that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities:- Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms.
- Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for the machine integration.
- Bachelor's or Master's degree: In Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of experience: In design and development of equipment's or semiconductor packaging or advanced interconnect processes.
This role offers the opportunity to work on cutting-edge technology and contribute to the development of innovative solutions. If you have a passion for engineering and design, and are looking for a challenging role that allows you to grow and develop your skills, then this may be the perfect opportunity for you.
