Advanced Semiconductor Packaging Specialist

Thermal Bonding Equipment SpecialistRole Overview:A Thermal Bonding Equipment Specialist is responsible for designing, developing, and optimizing thermal bonding equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...

TCB Design Engineer Job SummaryThis role is responsible for designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. The TCB Design Engineer will play a critical part in ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.

Job Title: High-Temperature Bonding SpecialistRole Summary:We are seeking a skilled professional to design and develop Thermo-Compression Bonding modules for advanced semiconductor packaging. The ideal candidate will be responsible for creating innovative designs that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or...

Job Title:TCB Design EngineerJob Description:We are seeking a skilled engineer to join our team in the design and development of TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The successful candidate will be responsible for designing, developing, and optimizing TCB modules.Key...

Job Title: Advanced Semiconductor Assembly SpecialistJob Summary:This is a challenging role for an experienced Packaging Engineer to take on, contributing to the success of our organization.We are seeking a highly skilled and experienced Senior Packaging Engineer to join us. The successful candidate will be responsible for developing advanced packaging...

**Job Overview**The role of a Thermal Control Specialist is crucial for the development and optimization of thermal management systems used in advanced semiconductor packaging equipment.**Key Responsibilities:Design and development of thermal control modules for Chip-to-Wafer or Chip-to-Substrate bonding.Creation of 3D designs and 2D drawings, BOM...

Job Title: Advanced Semiconductor Equipment SpecialistWe are seeking a highly skilled technical specialist to carry out scheduled preventive maintenance for semiconductor equipment.Main Responsibilities:Maintain and repair semiconductor equipment to prevent breakdowns.Conduct daily workplace inspections to ensure a clean and safe environment.Support...

Advanced Semiconductor Bonding ExpertWe are seeking a highly skilled professional to lead the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.Develop and optimize software and hardware applications for advanced die bonding processes.Analyze customer requirements and translate them...