Advanced Semiconductor Bonding Specialist

1 day ago

Singapore beBeeSemiconductor Full time $90,000 - $120,000
Advanced Semiconductor Bonding Expert

We are seeking a highly skilled professional to lead the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.

  • Develop and optimize software and hardware applications for advanced die bonding processes.
  • Analyze customer requirements and translate them into customized semiconductor packaging solutions.
  • Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies.
  • Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.

The ideal candidate should have a strong technical background, excellent communication and interpersonal skills, and the ability to work independently and in cross-functional teams. A Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field) is required, along with 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing.

We offer a dynamic and challenging work environment, with opportunities for professional growth and development. If you are a motivated and skilled individual looking to make a meaningful contribution to the advancement of semiconductor packaging technologies, we encourage you to apply.

Required Skills:
- Strong technical background in engineering
- Excellent communication and interpersonal skills
- Ability to work independently and in cross-functional teams
- 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing

Benefits:
We offer a dynamic and challenging work environment, with opportunities for professional growth and development.

About Us:
We are a leading manufacturer of advanced semiconductor packaging solutions.

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