Semiconductor Bonding Expert

Job TitleAchieve Excellence in Semiconductor Bonding as a Thermal Design Expert">About the Role:">This is an exciting opportunity to join our team as a Thermal Design Engineer, where you will be responsible for designing, developing, and optimizing the Thermo Compression Bonding (TCB) modules subsystem used in advanced semiconductor packaging.">Your Key...

Job Summary:We are seeking an experienced Semiconductor Bonding Specialist to join our team. In this role, you will be responsible for designing and developing innovative bonding solutions for semiconductor packaging.Key Responsibilities:Bonding Solution DevelopmentDesign cutting-edge bonding module assemblies for Chip-to-Wafer or Chip-to-Substrate...

Our client is a startup in the field of semiconductor equipment and is currently in the process of setting up a new R&D Center in Singapore. We are looking for an expert in the field of Hybrid Bonding for the R&D team in Singapore. **R&D Expert, Hybrid Bonding** **Responsibilities**: You will be reporting to the CTO based in Singapore and oversee the...

Advanced Semiconductor Packaging SpecialistThe role of a semiconductor packaging specialist is to design, develop and optimize advanced semiconductor packages. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key Responsibilities:Design innovative semiconductor...

Position title : Laser-Assisted Bonder (LAB) process engineer / Semiconductor Process Engineer (Laser Bonding)Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding...

Thermo Compression Bonding (TCB) Module Design ExpertWe are seeking an experienced and skilled Thermo Compression Bonding (TCB) Module Design Expert to join our team.The successful candidate will be responsible for designing innovative TCB module assemblies for advanced semiconductor packaging, including 3D design and 2D drawings, bill of materials...

As a Chip-to-Wafer/Chip-to-Substrate Bonding Specialist, you will play a pivotal role in designing and developing TCB modules for thermal performance optimization. Your key responsibilities will include creating 3D models, 2D drawings, BOMs, FMEA, DFMA, managing prototyping, testing, and troubleshooting to ensure reliable bonding results.Key...

Advanced Packaging Process EngineerWe are seeking a highly skilled Advanced Packaging Process Engineer to develop, optimize and maintain laser bonding processes for high-precision and high-reliability applications.Key Responsibilities:Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects and micro-assembly,...

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem...

Advanced Semiconductor Packaging ExpertThis is a challenging role that requires designing and developing cutting-edge TCB modules for semiconductor packaging.As an expert in thermal management, you will be responsible for optimizing the performance of our TCB equipment by minimizing thermal gradients and maximizing temperature uniformity. Your work will...